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Assembly and Package are the two core processes of electronic manufacturing, involving many complex and key technologies, including materials, processes, equipment, design, reliability analysis of detection and so on. Huabi Laboratory Reliability and Failure Analysis Division, with a professional team, has established a perfect technical support service system around the requirements of electronic manufacturing, escorted the manufacturing of electronic information products, and solved many key technical requirements for the industry. At the same time, in order to ensure the leading level of manufacturing technology services, we have been in close technical exchanges and cooperation with many institutions and organizations in the industry, such as IPC, IEC and SMT associations.

Comprehensive technology capabilities

Electronic technology material testing analysis

A comprehensive analysis of the performance and reliability parameters of the materials involved in the manufacturing process can be carried out according to various technical standards.

Detection: Solder　Used Solder　Solder Wire　Solder Paste  Flux　Detergent　Adhesive　PCB

Components Manufacturability Evaluation

Solderability　Heat Endurance　Tin Whisker   MSL   Resistance to Dissolution of Metallization

Failure Analysis

PCB　PCBA　 lead-free solder joints     Package

Process Design

DFM　DFR

Reliability Analysis & Evaluation

Lead-free Solder Joints　 Lead-free Components　 Lead-free PCBA

Lead-free Process Consultation

Process Optimizing　Materials Choice　Process Control