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Electronic failure analysis

Failure analysis is a kind of post-analysis work for invalid products. By using various testing and analysis techniques and procedures, the failure phenomena of products are confirmed, the failure modes or mechanisms are distinguished, the final causes are determined, and suggestions for improving design and manufacturing processes are put forward to eliminate the failure and prevent the recurrence of failure. To improve the reliability of components is an important part of product reliability engineering.

Techniques for Failure Analysis

Decapsulation Sampling	FTIR
Metallographic	AES
Staining	EMMI
SEM and EDS	SAM
FEA	X-Ray
TEM	XRF
Micro Raman Spectroscopy	XRD
Infrared Thermography

Failure analysis capabilities area

Monolithic	Microwave Device /Module
Hybrid IC	Miniature Complete Appliance
PCBA Subassembly	Electromechanical Subassembly
Discrete Component	Photoconducting Device
Discrete Device	Battery

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Industrial Automotive Testing：

4008-285-622

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4008-850-960

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4008-310-580

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4009-282-155

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4008-202-508

Shanghai Laboratory：

NO.1600 A8 Building, GuoQuan North Road,

Yangpu District, Shanghai City

Suzhou Laboratory：

NO.16th Building, NO.99th GangTian Road,

Suzhou Industrial Park, Suzhou City, Jiangsu Province